Semiconductor Die Formation and Packaging Thereof

The present invention relates to a method for forming and packaging a semiconductor die to reduce the height of silicon debris (grooving burr or Si debris) by changing the structure of a passivation insulating film formed on a scribe line of the semiconductor die. The present invention provides a st...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHIM DONG KI, SONG BYEUNG SOO, CHOI JAE SIK, BAE JIN HAN, JEONG JIN WON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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