HEAT TREATMENT APPARATUS FOR SEMICONDUCTOR SUBSTRATE

The present invention is to provide a heat treatment apparatus for a semiconductor substrate capable of a low oxidation atmosphere so as to reduce contact resistance in a contact region of a semiconductor device. According to an embodiment of the present invention, a heat treatment apparatus compris...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SON GIL HWAN, KWAK NOH SUNG, KIM TAE GON, LEE DAE YEONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention is to provide a heat treatment apparatus for a semiconductor substrate capable of a low oxidation atmosphere so as to reduce contact resistance in a contact region of a semiconductor device. According to an embodiment of the present invention, a heat treatment apparatus comprises: a substrate transfer module (equipment front end module, EFEM) having a gas inlet and a gas outlet; one or more heat treatment chambers which receive a substrate from the EFEM and perform heat treatment; and a gas circulator for supplying an antioxidant gas through the gas inlet and circulating and supplying the antioxidant gas discharged through the gas outlet back to the gas inlet. The heat treatment apparatus regulates the oxygen concentration of the EFEM to less than 1ppm through an antioxidant gas. 본 발명의 기술적 사상의 실시예에 따른 열처리 장치는, 가스 주입부(inlet) 및 가스 배출부(outlet)를 구비하는 기판 이송 모듈(Equipment Front End Module, EFEM), EFEM으로부터 기판을 공급받아 열처리를 수행하는 하나 이상의 열처리 챔버, 및 가스 주입부를 통하여 산화 방지 가스를 공급하고 가스 배출부를 통하여 배출되는 산화 방지 가스를 다시 가스 주입부로 순환 공급하는 가스 순환기를 포함하고, 산화 방지 가스를 통하여 EFEM의 산소 농도를 1ppm 이하로 조절한다.