MANUFACTURING METHOD OF LIGHTING SENSOR PACKAGE

According to the present invention, disclosed are a method of manufacturing an optical sensor package which includes: a base step of arranging a lead frame and an output terminal; an element arrangement step of arranging a receiving element for receiving an IR band signal and an amplifying element i...

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Bibliographische Detailangaben
Hauptverfasser:	JUNG CHEOL MIN, LEE, HYUN YOUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS COLORIMETRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PHYSICS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL RADIATION PYROMETRY SEMICONDUCTOR DEVICES SEPARATION SPRAYING OR ATOMISING IN GENERAL TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	According to the present invention, disclosed are a method of manufacturing an optical sensor package which includes: a base step of arranging a lead frame and an output terminal; an element arrangement step of arranging a receiving element for receiving an IR band signal and an amplifying element in the lead frame; a connecting step of connecting the receiving element and the amplifying element with a wire, and connecting the amplifying element with the output terminal with the wire; a case arrangement step of arranging the receiving element and the amplifying element inside the case, wherein a shield case has an opening formed on one surface thereof and the side of the shield case is disposed so as to contact the lead frame; and a coating agent injection step of injecting an IR coating agent into the opening to inject the IR coating agent into the shield case. 리드프레임과 출력단자를 배치하는 베이스단계 상기 리드프레임에 IR대역 신호를 수신하는 수신소자와 증폭소자를 배치하는 소자배치단계 상기 수신소자와 증폭소자를 와이어로 연결하고, 상기 증폭소자를 상기 출력단자와 와이어로 연결하는 연결단계 상기 수신소자와 증폭소자가 내측에 배치되고, 일면에 개구부가 형성되는 실드케이스를 측부가 상기 리드프레임과 맞닿도록 배치하는 케이스배치단계 및 상기 개구부로 IR코팅제를 주입하여 상기 실드케이스 내부에 IR코팅제를 주입하는 코팅제주입단계를 포함하는 광센서 패키지 제조방법이 개시된다.