A thermal radiation body for cooling heating element and method for manufacturing the same

The present invention relates to a thermal radiator for cooling a heating element and a manufacturing method thereof and, more specifically, to a thermal radiator for cooling a heating element to radiate heat of a thermal radiator by heat radiation and a manufacturing method thereof. According to on...

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Bibliographische Detailangaben
Hauptverfasser: KIM KA YOUN, KIM SUNG HEE, BAE DUK KYU, KIM SUN KYUNG, CHO JIN WOO
Format: Patent
Sprache:eng ; kor
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Zusammenfassung:The present invention relates to a thermal radiator for cooling a heating element and a manufacturing method thereof and, more specifically, to a thermal radiator for cooling a heating element to radiate heat of a thermal radiator by heat radiation and a manufacturing method thereof. According to one embodiment of the present invention, the thermal radiator for cooling a heating element includes a pattern unit radiating heat received from a heating element to the outside. The pattern unit may include a void unit located on the heating element and filled with an empty space or a gas and a cover unit defining an area of the void unit by covering the void unit, wherein at least a part of the cover unit is thermally connected to the heating element. 본 발명은 발열체 냉각용 열복사체 및 그 제조방법에 관한 것으로, 더욱 상세하게는 열복사에 의해 발열체를 방열시키는 발열체 냉각용 열복사체 및 그 제조방법에 관한 것이다. 본 발명의 일실시예에 따른 발열체 냉각용 열복사체는 발열체로부터 전달받은 열을 외부로 복사 방출시키는 패턴부;를 포함하고, 상기 패턴부는, 상기 발열체 상에 위치하며, 빈 공간 또는 가스상으로 채워진 공극부; 및 적어도 일부가 상기 발열체에 열적으로 연결되며, 상기 공극부를 덮어 상기 공극부의 영역을 정의하는 커버부를 포함할 수 있다.