SEMICONDUCTOR RESIST COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION
The present invention relates to a semiconductor photoresist composition comprising an organometallic copolymer comprising a structural unit represented by chemical formula 1 and a structural unit represented by chemical formula 2, and a solvent; and a pattern forming method using the same. Detailed...
Gespeichert in:
Hauptverfasser: | , , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; kor |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The present invention relates to a semiconductor photoresist composition comprising an organometallic copolymer comprising a structural unit represented by chemical formula 1 and a structural unit represented by chemical formula 2, and a solvent; and a pattern forming method using the same. Detailed description for chemical formula 1 and chemical formula 2 are defined in the specification. According to the present invention, the semiconductor photoresist composition has relatively improved etch resistance, sensitivity, and resolution.
하기 화학식 1로 표현되는 구조단위 및 하기 화학식 2로 표현되는 구조단위를 포함하는 유기금속공중합체 및 용매를 포함하는 반도체 포토 레지스트용 조성물과, 이를 이용한 패턴 형성 방법에 관한 것이다. [화학식 1][화학식 2]화학식 1, 화학식 2에 대한 구체적인 내용은 명세서 상에서 정의된 것과 같다. |
---|