DISPLAY DEVICE

An object of the present invention is to provide a display device with an improved bonding defect between a printed circuit board and a chip-on film. To this object, the present invention provides the display device including: a printed circuit board which is formed of N layers and includes at least...

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Bibliographische Detailangaben
Hauptverfasser:	CHOI JUN YONG, LEE HYUN AE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	An object of the present invention is to provide a display device with an improved bonding defect between a printed circuit board and a chip-on film. To this object, the present invention provides the display device including: a printed circuit board which is formed of N layers and includes at least one layer in which a PCB pad including PCB electrode patterns and PCB ground patterns are formed; and the chip-on film in which a COF pad is formed, wherein the PCB electrode patterns included in the first to Nth layers of the printed circuit board are connected in order, and the PCB pad formed on the Nth layer of the printed circuit board is coupled to the COF pad of the chip-on film. 본 발명의 목적은 인쇄회로기판과 칩온필름 사이의 결합 불량을 개선한 표시장치를 제공하는 것이다. 이를 위하여 본 발명은 N개의 레이어로 형성되고, PCB 전극패턴과 PCB 그라운드 패턴을 포함하는 PCB 패드부가 형성되는 레이어를 1개 이상 포함하는 인쇄회로기판과; COF 패드부가 형성되는 칩온필름을 포함하고, 상기 인쇄회로기판의 제 1 내지 제 N 레이어에 포함된 PCB 전극패턴은 순서대로 연결되며, 상기 인쇄회로기판의 제 N 레이어에 형성된 PCB 패드부는 상기 칩온필름의 COF 패드부와 결합하는 표시장치를 제공한다.