3D METHOD OF FORMING A THERMAL SHIELD IN A MONOLITHIC 3-D INTEGRATED CIRCUIT
A monolithic three-dimensional (3D) integrated circuit is provided. According to the present invention, the monolithic 3D integrated circuit comprises: a first device; a second device on the first device; and a heat shield stack disposed between the first device and the second device. The heat shiel...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng ; kor |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A monolithic three-dimensional (3D) integrated circuit is provided. According to the present invention, the monolithic 3D integrated circuit comprises: a first device; a second device on the first device; and a heat shield stack disposed between the first device and the second device. The heat shield stack includes a thermal retardation section with low thermal conductivity in the vertical direction and a heat diffusion section with high thermal conductivity in the horizontal direction. The heat shield stack includes only an insulating material.
모노리식 3차원 집적 회로가 제공된다. 상기 모노리식 3차원 집적 회로는 제1 장치, 제1 장치 상에, 제2 장치; 및 제1 장치 및 제2 장치 사이에 배치된 열 차폐 스택을 포함하되, 열 차폐 스택은, 수직방향으로 낮은 열 전도도를 가는 열 지연부, 수평방향으로 높은 열 전도도를 갖는 열 확산부를 포함한다. 상기 열 차폐 스택은 오로지 절연 물질을 포함한다. |
---|