PRINTED CIRCUIT BOARD
According to an embodiment of the present invention, provided is a printed circuit board which can increase power integrity. The printed circuit board comprises: an insulating material formed with a cavity; a first electronic element located in the cavity; and a second electronic element located on...
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Format: | Patent |
Sprache: | eng ; kor |
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Zusammenfassung: | According to an embodiment of the present invention, provided is a printed circuit board which can increase power integrity. The printed circuit board comprises: an insulating material formed with a cavity; a first electronic element located in the cavity; and a second electronic element located on the first electronic element in the cavity. The second electronic element is inserted into a groove portion formed on an upper surface of the first electronic element.
본 발명의 일 측면에 따른 인쇄회로기판은, 캐비티가 형성된 절연재; 상기 캐비티 내에 위치하는 제1 전자소자; 및 상기 캐비티 내의 상기 제1 전자소자 상에 위치하는 제2 전자소자를 포함하고, 상기 제2 전자소자는 상기 제1 전자소자의 상면에 형성된 홈부에 삽입된다. |
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