Manufacturing method of transparent conducting film

The present invention relates to a method for manufacturing a transparent conductive film. The method for manufacturing the transparent conductive film according to an embodiment of the present invention includes the steps of: forming a photoresist layer on a substrate; forming a pattern by removing...

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Bibliographische Detailangaben
Hauptverfasser: OH CHAN KWON, MIN WOO SIG, LEE DAVID
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:The present invention relates to a method for manufacturing a transparent conductive film. The method for manufacturing the transparent conductive film according to an embodiment of the present invention includes the steps of: forming a photoresist layer on a substrate; forming a pattern by removing a portion of the photoresist layer so that a portion of the substrate is exposed to the outside; forming a seed layer on the photoresist layer and substrate of which a portion is exposed to the outside; modifying at least a portion of the surface of the seed layer; removing the seed layer formed on the photoresist layer; performing electroless plating so as to form a first plating film on the seed layer formed on the substrate of which a portion is exposed to the outside; and removing the photoresist layer. Therefore, it is possible to provide the method of manufacturing the transparent conductive film having a large area. 본 발명은 투명전도막의 제조방법에 관한 것으로, 본 발명의 실시 예를 따르는 투명전도막의 제조방법은, 기판 상에 포토레지스트층을 형성하는 단계; 상기 기판의 일부가 외부로 노출되도록 상기 포토레지스트층의 일부를 제거하여 패턴을 형성하는 단계; 상기 일부가 외부로 노출된 기판 및 포토레지스트층 상에 씨드층을 형성하는 단계; 상기 씨드층의 표면 중 적어도 일부를 개질하는 단계; 상기 포토레스트층 상에 형성된 씨드층을 제거하는 단계; 무전해도금을 수행하여 상기 일부가 외부로 노출된 기판 상에 형성된 씨드층 상에 제 1 도금막을 형성하는 단계; 및 상기 포토레지스트층을 제거하는 단계;를 포함한다.