PRINTED CIRCUIT BOARD AND ANTENNA MODULE

A printed circuit board according to one embodiment includes a substrate; a first pattern layer on the substrate; a second pattern layer under the substrate; a first adhesive layer between the substrate and the first pattern layer; and a second adhesive layer between the substrate and the second pat...

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Bibliographische Detailangaben
Hauptverfasser:	YANG EUI YEOL, LIM JEE HEE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A printed circuit board according to one embodiment includes a substrate; a first pattern layer on the substrate; a second pattern layer under the substrate; a first adhesive layer between the substrate and the first pattern layer; and a second adhesive layer between the substrate and the second pattern layer. The first adhesive layer has a contact angle of 120° or less with respect to the first pattern layer, and the second adhesive layer has a contact angle of 120° or less with respect to the second pattern layer. 실시예에 따른 인쇄회로기판은 기판; 상기 기판 상에 제 1 패턴층; 상기 기판 하부의 제 2 패턴층; 상기 기판 및 상기 제 1 패턴층 사이의 제 1 접착층; 및 상기 기판 및 상기 제 2 패턴층 사이의 제 2 접착층을 포함하고, 상기 제 1 접착층은 상기 제 1 패턴층에 대해 120° 이하의 접촉각을 가지고, 상기 제 2 접착층은 상기 제 2 패턴층에 대해 120° 이하의 접촉각을 가진다.