THERMOSETTING FOAM METHOD OF PRODUCING THE SAME AND INSULATING MATERIAL

Provided is a thermosetting foam which contains a thermosetting resin, a curing agent, a foaming agent, and a composite flame retardant. The composite flame retardant includes phosphorus and a pentaerythritol-based compound, and the thermal conductivity measured at an average temperature of 20°C acc...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	DO HUN KIM, SUNG JAE BAE, IN SUNG PARK, KYUNG SUH MINN, CHAE HOON KIM, MYEONG HEE KIM, HYE MIN HA, GIL HO KANG, GUN PYO PARK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided is a thermosetting foam which contains a thermosetting resin, a curing agent, a foaming agent, and a composite flame retardant. The composite flame retardant includes phosphorus and a pentaerythritol-based compound, and the thermal conductivity measured at an average temperature of 20°C according to KS L 9016 is 0.016 to 0.029 W/m·K. 열경화성 수지, 경화제, 발포제 및 복합 난연제를 포함하고, 상기 복합 난연제는 인(Phosphorus) 및 펜타에리트리톨계 화합물을 포함하고, KS L 9016에 따른 평균 온도 20℃에서 측정한 열전도율이 0.016 W/m·K 내지 0.029 W/m·K 인 열경화성 발포체가 제공된다.