METHOD FOR ADJUSTING A CHIP CONVEYING APPARATUS AND CHIP CONVEYING APPARATUS
The present invention relates to a method for adjusting a chip moving device and the chip moving device, in which a load sensor is installed in a robot arm. The method for adjusting a chip moving device obtains power and time charts generated when chips are separated from fixing equipment through th...
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| creator | LIU CHIN CHENG CHUANG MU CHIN TSENG SHENG TOU LIN CHIA WEI TSENG JEN TUNG CHEN PING KU HSU KUN CHI SONG CHENG HUNG WU CHIN TA |
| description | The present invention relates to a method for adjusting a chip moving device and the chip moving device, in which a load sensor is installed in a robot arm. The method for adjusting a chip moving device obtains power and time charts generated when chips are separated from fixing equipment through the load sensor and adjusts components of the chip moving device through the power and time charts. Therefore, the method for adjusting a chip moving device can detect the most suitable combination of components and parameters for separating the various chips from the fixing equipment and can prevent abnormalities or damage generated when the chips are separated from the fixing equipment in case of mass production.
본 발명은 하중 센서를 로봇암에 설치하는 칩 이동 기기의 조정 방법 및 그 칩 이동 기기에 관한 것이다. 하중 센서를 통해 칩이 고정 이큅먼트로부터 이탈되는 과정에서 발생되는 힘 및 타임 차트를 획득하고, 상기 힘과 타임 차트를 통해 칩 이동 기기의 부품을 조정한다. 이로써 다양한 칩을 고정 이큅먼트로부터 이탈시키는데 가장 적합한 부품 및 파라미터의 조합을 발견할 수 있고, 나아가 대량 제조시, 칩이 고정 이큅먼트로부터 이탈되는 과정에서 발생되는 이상 또는 파손을 방지한다. |
| format | Patent |
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본 발명은 하중 센서를 로봇암에 설치하는 칩 이동 기기의 조정 방법 및 그 칩 이동 기기에 관한 것이다. 하중 센서를 통해 칩이 고정 이큅먼트로부터 이탈되는 과정에서 발생되는 힘 및 타임 차트를 획득하고, 상기 힘과 타임 차트를 통해 칩 이동 기기의 부품을 조정한다. 이로써 다양한 칩을 고정 이큅먼트로부터 이탈시키는데 가장 적합한 부품 및 파라미터의 조합을 발견할 수 있고, 나아가 대량 제조시, 칩이 고정 이큅먼트로부터 이탈되는 과정에서 발생되는 이상 또는 파손을 방지한다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPDxdQ3x8HdRcPMPUnB08QoNDvH0c1dwVHD28AxQcPb3C3ONBAsEBDgGOYaEBis4-rnglORhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHeQUYGRgYGBuYGBqbGjsbEqQIAX_guqA</recordid><startdate>20200617</startdate><enddate>20200617</enddate><creator>LIU CHIN CHENG</creator><creator>CHUANG MU CHIN</creator><creator>TSENG SHENG TOU</creator><creator>LIN CHIA WEI</creator><creator>TSENG JEN TUNG</creator><creator>CHEN PING KU</creator><creator>HSU KUN CHI</creator><creator>SONG CHENG HUNG</creator><creator>WU CHIN TA</creator><scope>EVB</scope></search><sort><creationdate>20200617</creationdate><title>METHOD FOR ADJUSTING A CHIP CONVEYING APPARATUS AND CHIP CONVEYING APPARATUS</title><author>LIU CHIN CHENG ; CHUANG MU CHIN ; TSENG SHENG TOU ; LIN CHIA WEI ; TSENG JEN TUNG ; CHEN PING KU ; HSU KUN CHI ; SONG CHENG HUNG ; WU CHIN TA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20200070053A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LIU CHIN CHENG</creatorcontrib><creatorcontrib>CHUANG MU CHIN</creatorcontrib><creatorcontrib>TSENG SHENG TOU</creatorcontrib><creatorcontrib>LIN CHIA WEI</creatorcontrib><creatorcontrib>TSENG JEN TUNG</creatorcontrib><creatorcontrib>CHEN PING KU</creatorcontrib><creatorcontrib>HSU KUN CHI</creatorcontrib><creatorcontrib>SONG CHENG HUNG</creatorcontrib><creatorcontrib>WU CHIN TA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIU CHIN CHENG</au><au>CHUANG MU CHIN</au><au>TSENG SHENG TOU</au><au>LIN CHIA WEI</au><au>TSENG JEN TUNG</au><au>CHEN PING KU</au><au>HSU KUN CHI</au><au>SONG CHENG HUNG</au><au>WU CHIN TA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR ADJUSTING A CHIP CONVEYING APPARATUS AND CHIP CONVEYING APPARATUS</title><date>2020-06-17</date><risdate>2020</risdate><abstract>The present invention relates to a method for adjusting a chip moving device and the chip moving device, in which a load sensor is installed in a robot arm. The method for adjusting a chip moving device obtains power and time charts generated when chips are separated from fixing equipment through the load sensor and adjusts components of the chip moving device through the power and time charts. Therefore, the method for adjusting a chip moving device can detect the most suitable combination of components and parameters for separating the various chips from the fixing equipment and can prevent abnormalities or damage generated when the chips are separated from the fixing equipment in case of mass production.
본 발명은 하중 센서를 로봇암에 설치하는 칩 이동 기기의 조정 방법 및 그 칩 이동 기기에 관한 것이다. 하중 센서를 통해 칩이 고정 이큅먼트로부터 이탈되는 과정에서 발생되는 힘 및 타임 차트를 획득하고, 상기 힘과 타임 차트를 통해 칩 이동 기기의 부품을 조정한다. 이로써 다양한 칩을 고정 이큅먼트로부터 이탈시키는데 가장 적합한 부품 및 파라미터의 조합을 발견할 수 있고, 나아가 대량 제조시, 칩이 고정 이큅먼트로부터 이탈되는 과정에서 발생되는 이상 또는 파손을 방지한다.</abstract><oa>free_for_read</oa></addata></record> |
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| title | METHOD FOR ADJUSTING A CHIP CONVEYING APPARATUS AND CHIP CONVEYING APPARATUS |
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