WAFER DIVIDING APPARATUS

The present invention relates to a wafer dividing apparatus capable of preventing the degradation in the quality of a chip. According to the present invention, the wafer dividing apparatus comprises: a cassette table; a first loading/unloading means; a first temporary accommodating means having a pa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATSUDA TOMOHITO, KAWAGUCHI YOSHIHIRO, FUJII YUHEI, TAKESUE NAOYA, MASADA TAKAYUKI, INAKAZU SUSUMU, SAITO RYOTA, ISHIDA HIDEAKI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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