PHOTOSENSITIVE RESIN COMPOSITION FILM AND ELECTRONIC DEVICE
The present invention relates to a photosensitive resin composition, which is capable of high resolution patterning at low light amount, has excellent pattern adhesion, is capable of fine patterning, and has excellent cured film properties, to a film, and to an electronic device. The photosensitive...
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| creator | HEO SUN HEE JO YONG JEONG BAE JUN AHN SANG YEOB LEE SEUL KI KIM JUN HWAN YOO CHUNG YOUL KIM JUN KI LEE DAE WON |
| description | The present invention relates to a photosensitive resin composition, which is capable of high resolution patterning at low light amount, has excellent pattern adhesion, is capable of fine patterning, and has excellent cured film properties, to a film, and to an electronic device. The photosensitive resin composition comprises a compound represented by chemical formula 1.
본 발명은 저광량에서 고해상도 패터닝이 가능하고, 패턴 밀착성이 우수하며, 미세한 패터닝이 가능하며, 경화막 특성이 우수한 감광성 수지 조성물, 필름 및 전자장치를 제공할 수 있다. |
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본 발명은 저광량에서 고해상도 패터닝이 가능하고, 패턴 밀착성이 우수하며, 미세한 패터닝이 가능하며, 경화막 특성이 우수한 감광성 수지 조성물, 필름 및 전자장치를 제공할 수 있다.</description><language>eng ; kor</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200608&DB=EPODOC&CC=KR&NR=20200064274A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200608&DB=EPODOC&CC=KR&NR=20200064274A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HEO SUN HEE</creatorcontrib><creatorcontrib>JO YONG JEONG</creatorcontrib><creatorcontrib>BAE JUN</creatorcontrib><creatorcontrib>AHN SANG YEOB</creatorcontrib><creatorcontrib>LEE SEUL KI</creatorcontrib><creatorcontrib>KIM JUN HWAN</creatorcontrib><creatorcontrib>YOO CHUNG YOUL</creatorcontrib><creatorcontrib>KIM JUN KI</creatorcontrib><creatorcontrib>LEE DAE WON</creatorcontrib><title>PHOTOSENSITIVE RESIN COMPOSITION FILM AND ELECTRONIC DEVICE</title><description>The present invention relates to a photosensitive resin composition, which is capable of high resolution patterning at low light amount, has excellent pattern adhesion, is capable of fine patterning, and has excellent cured film properties, to a film, and to an electronic device. The photosensitive resin composition comprises a compound represented by chemical formula 1.
본 발명은 저광량에서 고해상도 패터닝이 가능하고, 패턴 밀착성이 우수하며, 미세한 패터닝이 가능하며, 경화막 특성이 우수한 감광성 수지 조성물, 필름 및 전자장치를 제공할 수 있다.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAO8PAP8Q929Qv2DPEMc1UIcg329FNw9vcN8AeJ-PspuHn6-Co4-rkouPq4OocE-ft5Oiu4uIZ5OrvyMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JJ47yAjAyMDAwMzEyNzE0dj4lQBAKtLKmA</recordid><startdate>20200608</startdate><enddate>20200608</enddate><creator>HEO SUN HEE</creator><creator>JO YONG JEONG</creator><creator>BAE JUN</creator><creator>AHN SANG YEOB</creator><creator>LEE SEUL KI</creator><creator>KIM JUN HWAN</creator><creator>YOO CHUNG YOUL</creator><creator>KIM JUN KI</creator><creator>LEE DAE WON</creator><scope>EVB</scope></search><sort><creationdate>20200608</creationdate><title>PHOTOSENSITIVE RESIN COMPOSITION FILM AND ELECTRONIC DEVICE</title><author>HEO SUN HEE ; JO YONG JEONG ; BAE JUN ; AHN SANG YEOB ; LEE SEUL KI ; KIM JUN HWAN ; YOO CHUNG YOUL ; KIM JUN KI ; LEE DAE WON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20200064274A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2020</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>HEO SUN HEE</creatorcontrib><creatorcontrib>JO YONG JEONG</creatorcontrib><creatorcontrib>BAE JUN</creatorcontrib><creatorcontrib>AHN SANG YEOB</creatorcontrib><creatorcontrib>LEE SEUL KI</creatorcontrib><creatorcontrib>KIM JUN HWAN</creatorcontrib><creatorcontrib>YOO CHUNG YOUL</creatorcontrib><creatorcontrib>KIM JUN KI</creatorcontrib><creatorcontrib>LEE DAE WON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HEO SUN HEE</au><au>JO YONG JEONG</au><au>BAE JUN</au><au>AHN SANG YEOB</au><au>LEE SEUL KI</au><au>KIM JUN HWAN</au><au>YOO CHUNG YOUL</au><au>KIM JUN KI</au><au>LEE DAE WON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHOTOSENSITIVE RESIN COMPOSITION FILM AND ELECTRONIC DEVICE</title><date>2020-06-08</date><risdate>2020</risdate><abstract>The present invention relates to a photosensitive resin composition, which is capable of high resolution patterning at low light amount, has excellent pattern adhesion, is capable of fine patterning, and has excellent cured film properties, to a film, and to an electronic device. The photosensitive resin composition comprises a compound represented by chemical formula 1.
본 발명은 저광량에서 고해상도 패터닝이 가능하고, 패턴 밀착성이 우수하며, 미세한 패터닝이 가능하며, 경화막 특성이 우수한 감광성 수지 조성물, 필름 및 전자장치를 제공할 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; kor |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
| title | PHOTOSENSITIVE RESIN COMPOSITION FILM AND ELECTRONIC DEVICE |
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