PHOTOSENSITIVE RESIN COMPOSITION FILM AND ELECTRONIC DEVICE

The present invention relates to a photosensitive resin composition, which is capable of high resolution patterning at low light amount, has excellent pattern adhesion, is capable of fine patterning, and has excellent cured film properties, to a film, and to an electronic device. The photosensitive...

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Bibliographische Detailangaben
Hauptverfasser:	HEO SUN HEE, JO YONG JEONG, BAE JUN, AHN SANG YEOB, LEE SEUL KI, KIM JUN HWAN, YOO CHUNG YOUL, KIM JUN KI, LEE DAE WON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	The present invention relates to a photosensitive resin composition, which is capable of high resolution patterning at low light amount, has excellent pattern adhesion, is capable of fine patterning, and has excellent cured film properties, to a film, and to an electronic device. The photosensitive resin composition comprises a compound represented by chemical formula 1. 본 발명은 저광량에서 고해상도 패터닝이 가능하고, 패턴 밀착성이 우수하며, 미세한 패터닝이 가능하며, 경화막 특성이 우수한 감광성 수지 조성물, 필름 및 전자장치를 제공할 수 있다.