POLISHING SLURRY COMPOSITION

The present invention relates to a polishing slurry composition capable of suppressing the occurrence of defects and dishing as much as possible and, more specifically, to a polishing slurry composition comprising: cerium oxide polishing particles; a dispersant; a first dishing inhibitor including a...

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Bibliographische Detailangaben
Hauptverfasser:	CHO HYUN HEE, RYU HYE RIM, SEO KANG KUK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVES CHEMISTRY DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SKI WAXES
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Beschreibung
Zusammenfassung:	The present invention relates to a polishing slurry composition capable of suppressing the occurrence of defects and dishing as much as possible and, more specifically, to a polishing slurry composition comprising: cerium oxide polishing particles; a dispersant; a first dishing inhibitor including an anionic polymer; and a second dishing inhibitor including a nonionic polymer, wherein the polishing particles include primary particles and secondary particles, and the secondary particles are that the primary particles are self-assembled. 본 발명은, 연마용 슬러리 조성물에 관한 것으로, 산화세륨계 연마 입자; 분산제; 음이온성 고분자를 포함하는 제1 디싱 억제제; 및 비이온성 고분자를 포함하는 제2 디싱 억제제;를 포함하고, 상기 연마 입자는 1차 입자 및 2차 입자를 포함하고, 상기 2차 입자는 1차 입자가 자가조립된 것인, 연마용 슬러리 조성물에 관한 것이다.