Apparatus for Processing Substrate

The present invention relates to a substrate processing apparatus which includes: a chamber; a first electrode positioned in an upper portion of the chamber; a second electrode positioned in a lower portion of the first electrode and including a plurality of openings; a plurality of protruding elect...

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Bibliographische Detailangaben
Hauptverfasser:	KIM YOUNG WOON, OH WOONG KYO, YOO KWANG SU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention relates to a substrate processing apparatus which includes: a chamber; a first electrode positioned in an upper portion of the chamber; a second electrode positioned in a lower portion of the first electrode and including a plurality of openings; a plurality of protruding electrodes extended from the first electrode to be extended to the plurality of openings of the second electrode; and a substrate mounting table which faces the second electrode and on which a substrate is mounted. In the openings of the second electrode, an opening area of an upper surface of the second electrode and an opening area of a lower surface of the second electrode are differently formed. Therefore, the substrate processing apparatus can increase efficiency of a processing process with respect to the substrate. 본 발명은 챔버; 상기 챔버 상부에 위치하는 제1전극; 상기 제1전극의 하부에 위치하고, 복수의 개구를 포함하는 제2전극; 상기 제1전극에서 연장되어 상기 제2전극의 복수의 개구로 연장되는 복수의 돌출전극; 및 상기 제2전극과 대향하고 기판이 안치되는 기판안치대를 포함하되, 상기 제2전극의 개구가 상기 제2전극의 상면의 개구면적과 상기 제2전극의 하면의 개구면적이 다르게 구현된 기판처리장치에 관한 것이다.