METHOD AND APPARATUS FOR PROCESSING SUBSTRATE

One embodiment of the present invention provides a substrate processing method which disposes a plurality of collecting cups in multiple stages, sprays treatment liquid to a substrate on a spin chuck disposed in the collecting cups, and performs a liquid treatment process. In a transitional time sec...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	OH SEUNG HOON, CHOI YOUNG JUN, WOO JONG HYEON, YU JIN TACK, JUNG BU YOUNG, BANG BYUNG SUN, KIM YOUNG JIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	One embodiment of the present invention provides a substrate processing method which disposes a plurality of collecting cups in multiple stages, sprays treatment liquid to a substrate on a spin chuck disposed in the collecting cups, and performs a liquid treatment process. In a transitional time section when a height change of any one collecting cup among the collecting cups occurs, a rotation speed of the spin chuck supporting the substrate is controlled in interworking with the height change of the collecting cup. According to the present invention, a delay of an entire process speed can be minimized. 본 발명의 일 실시예는, 복수의 회수컵이 다단으로 배치되고, 상기 회수컵의 내측에 배치된 스핀척 상의 기판에 처리액을 분사하여 액처리 공정을 진행하는 기판 처리 방법으로서, 상기 회수컵들 중 어느 하나의 회수컵의 높이 변경이 일어나는 과도적인 시간 구간에서, 상기 회수컵의 높이 변경과 연동하여 기판을 지지하는 스핀척의 회전 속도를 조절하는 기판 처리 방법을 제공한다.