SPUTTERING APPARATUS

Disclosed is a sputtering apparatus capable of reducing the distance between a substrate and a target while achieving stable discharge and minimizing damage to the substrate. The sputtering apparatus includes a cylindrical tube, a substrate support portion, a pair of wave guides, a pair of microwave...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DO JAE CHUL, CHOI WOO JIN, LEE JUNG RAK, PARK WAN WOO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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