PRESSURE-SENSITIVE ADHESIVE COMPOSITION SURFACE PROTECTIVE FILM AND METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING ELECTRONIC DEVICE

The present invention relates to an adhesive composition, to a surface protection film which can prevent contamination of an adherend surface from external environment during a process, and to a manufacturing method of an organic light-emitting electronic device. The adhesive composition comprises:...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	JUNG SAYYOUNG, RYU DONG HWAN, HWANG KYUSEOK, LEE DAE HYUCK, LEE SANG JIN, LEE JOO WON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to an adhesive composition, to a surface protection film which can prevent contamination of an adherend surface from external environment during a process, and to a manufacturing method of an organic light-emitting electronic device. The adhesive composition comprises: a (meth)acrylate resin containing an unsaturated group; a photo-initiator; and an isocyanate-based curing agent. 본 발명은 점착제 조성물, 표면 보호 필름 및 유기 발광 전자 장치의 제조 방법에 관한 것이다.