APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

One embodiment of the present invention provides a substrate processing method which comprises: a step of supplying a high surface tension liquid to a surface of a substrate to form a high surface tension liquid film; a step of supplying a low surface tension liquid to a center region of the substra...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	OH SEUNG HOON, CHOI YOUNG JUN, WOO JONG HYEON, YU JIN TACK, JUNG BU YOUNG, BANG BYUNG SUN, KIM YOUNG JIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	One embodiment of the present invention provides a substrate processing method which comprises: a step of supplying a high surface tension liquid to a surface of a substrate to form a high surface tension liquid film; a step of supplying a low surface tension liquid to a center region of the substrate having the high surface tension liquid film formed thereon to substitute the high surface tension liquid film with the low surface tension liquid; and a step of additionally supplying the high surface tension liquid for at least a part of time period of the low surface tension liquid supplying step. According to the present invention, a drying process can be stably performed. 본 발명의 일 실시예는, 기판 표면에 고표면장력 액체를 공급하여 고표면장력 액막을 형성하는 단계; 상기 고표면장력 액막이 형성된 기판의 중심 영역에 저표면장력 액체를 공급함으로써 상기 고표면장력 액막을 상기 저표면장력 액체로 치환하는 단계; 상기 저표면장력 액체를 공급하는 단계 중 적어도 일부 시간 구간 동안, 상기 고표면장력 액체를 추가 공급하는 단계;를 포함하는 기판 처리 방법을 제공한다.