Carrier substrate and packaging method using it
Provided is a carrier substrate which comprises a first layer; a second layer; and a first adhesive layer between the first layer and the second layer, wherein the first adhesive layer can be detachable from the first layer. According to the present invention, difference in a thermal expansion coeff...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | Provided is a carrier substrate which comprises a first layer; a second layer; and a first adhesive layer between the first layer and the second layer, wherein the first adhesive layer can be detachable from the first layer. According to the present invention, difference in a thermal expansion coefficient can be offset.
제1 층; 제2 층; 및 상기 제1 층 및 상기 제2 층 사이의 제1 접착층을 포함하며, 상기 제1 접착층은 상기 제1 층으로부터 탈착 가능한 캐리어 기판이 제공된다. |
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