Resin composition for mold cleaning

The present invention relates to a mold cleaning resin composition for removing dirt on a surface of a mold for thermosetting resin molding and, more specifically, to a mold cleaning resin composition comprising a melamine resin and a guanamine-based resin produced by mixing and polymerizing mixing...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	CHAE YOUNG JUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to a mold cleaning resin composition for removing dirt on a surface of a mold for thermosetting resin molding and, more specifically, to a mold cleaning resin composition comprising a melamine resin and a guanamine-based resin produced by mixing and polymerizing mixing melamine and formalin for 90 to 120 minutes at 90°C. According to the mold cleaning resin composition, it has an impact strength not easily damaged by external impacts, and has an effect of minimizing the flying of resin powder during a transportation process. Accordingly, a mold cleaning resin product can be stably supplied to customers without deterioration in quality, and it is also possible to minimize a decrease in semiconductor chip production efficiency. 본 발명은 열경화성 수지 성형용 금형 표면의 오물을 제거하는 몰드 클리닝 수지 조성물에 관한 것으로, 보다 구체적으로 멜라민과 포르말린을 혼합하여 90℃에서 90 내지 120 분 동안 중합반응 시켜 생성된 멜라민 수지 및 구안아민계 수지를 포함하는 것을 특징으로 한다. 본 발명에 따른 몰드 클리닝 수지 조성물에 의하면, 외부 충격에도 쉽게 파손되지 않는 충격 강도를 가지고, 운반 과정 중 수지 분말이 날리는 것을 최소화할 수 있는 효과가 있으며, 이에 따라 몰드 클리닝 수지 제품을 품질 저하 없이 수요처에 안정적으로 공급할 수 있고, 반도체 칩 생산 효율의 저하도 최소화할 수 있다.