CUTTING APPARATUS FOR OPTICAL FILM AND METHOD FOR CUTTING OPTICAL FILM

The present application relates to an optical film cutting machine, a cutting method of an optical film, the optical film, an organic electronic apparatus including the same, and a manufacturing method of the organic electronic apparatus using the same. In manufacturing the optical film, provided ar...

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Bibliographische Detailangaben
Hauptverfasser:	ROH JONG PIL, CHOI TAE JIN, KIM MIN KYUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CUTTING DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING HAND CUTTING TOOLS PERFORMING OPERATIONS PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE SEVERING TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The present application relates to an optical film cutting machine, a cutting method of an optical film, the optical film, an organic electronic apparatus including the same, and a manufacturing method of the organic electronic apparatus using the same. In manufacturing the optical film, provided are the cutting machine for the optical film which can maintain efficiency of a process and reliability of the film, and the method for cutting the optical film. The cutting machine comprises: a first cutting machine which cuts a first side of a polygonal optical film; and a second cutting machine which cuts a second side adjacent to the first side. 본 출원은 광학 필름 재단기, 광학 필름의 재단 방법, 광학 필름, 이를 포함하는 유기전자장치 및 이를 이용한 유기전자장치의 제조방법에 관한 것으로서, 광학 필름을 제조함에 있어서, 공정의 효율 및 필름의 신뢰성을 유지할 수 있는 광학 필름용 재단기 및 상기 광학 필름을 재단하는 방법을 제공한다.