SEMICONDUCTOR PACKAGE

One embodiment of the present disclosure provides a semiconductor package comprising: a connection structure which has a first side and a second side at opposite positions to each other and has a rewiring layer; a semiconductor chip disposed on the first side of the connection structure and having a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHOI WON, BAE SUNG HAWN, KIM JUNG SOO, HAN PYUNG HWA
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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