POLISHING SLURRY COMPOSITION

The present invention relates to a polishing slurry composition capable of stably maintaining dispersion stability and, more specifically, to a polishing slurry composition comprising: abrasive particles; a dispersant; a stabilizer; and a polishing selectivity adjusting agent, wherein the dispersant...

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Bibliographische Detailangaben
Hauptverfasser:	JANG HYUN JUN, LEE SUNG PYO, KWON CHANG GIL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES
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Beschreibung
Zusammenfassung:	The present invention relates to a polishing slurry composition capable of stably maintaining dispersion stability and, more specifically, to a polishing slurry composition comprising: abrasive particles; a dispersant; a stabilizer; and a polishing selectivity adjusting agent, wherein the dispersant includes an aromatic organic acid containing at least one carboxyl group (-COOH). 본 발명은, 연마입자; 분산제; 안정화제; 및 연마 선택비조절제;를 포함하고, 상기 분산제는, 하나 이상의 카르복실기(-COOH)를 포함하는 방향족 유기산을 포함하는 것인, 연마용 슬러리 조성물에 관한 것이다.