CHEMICAL MECHANICAL POLISHING APPARATUS

According to an embodiment of the present invention, a chemical mechanical polishing apparatus comprises: a polishing head including a polishing head body, a membrane attached to a lower portion of the polishing head body, and a reflector disposed between the polishing head body and the membrane; a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OH SANG YEON, JEON IK SEON, KIM SUNG HYUP, CHOI JI MIN, KOO NAM IL, HONG EUN KYUNG, LEE JI MIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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