Semiconductor package

A semiconductor package is provided. The semiconductor package comprises: a mounting substrate comprising a first bonding pad; a first semiconductor chip disposed on the mounting substrate, and comprising a first protrusion on one side; a first spacer ball electrically connected to the first semicon...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HAN WON GIL, HAN HO SOO, LEE SAET BYEOL, SON YOU KYUNG, LEE SEUNG LO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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