APPARATUS AND METHOD OF STRIPPING A SUBSTRATE
The present invention relates to a substrate stripping method. According to one embodiment of the present invention, the substrate stripping method may comprise: a mixing step of generating stripping fluid containing ozone gas; and a step of removing a photoresist from a surface of a substrate using...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | The present invention relates to a substrate stripping method. According to one embodiment of the present invention, the substrate stripping method may comprise: a mixing step of generating stripping fluid containing ozone gas; and a step of removing a photoresist from a surface of a substrate using the stripping fluid. The present invention has an effect of reducing costs required for treating wastewater and preventing environmental pollution from being caused by using ozone gas instead of sulfuric acid.
본 발명은 기판 스트립 방법에 관한 것이다. 본 발명의 일 실시 예에 따른 기판 스트립 방법은 오존 가스가 포함된 스트립 유체를 생성하는 혼합 단계; 및 상기 스트립 유체를 이용하여 기판 표면의 포토레지스트를 제거하는 단계를 포함할 수 있다. |
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