SUBSTRATE HEATING APPARATUS AND SUBSTRATE PROCESSING SYSTEM

The present invention makes it difficult to limit a heating temperature of a substrate and suppresses attachment of a sublimate to the inside of a chamber. A substrate heating apparatus of an embodiment includes: a chamber formed with a receiving space capable of receiving a solution-coated substrat...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HOSODA HIROSHI, KONISHI KIYOTAKA, SUEKANE DAISUKE, KATO SHIGERU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention makes it difficult to limit a heating temperature of a substrate and suppresses attachment of a sublimate to the inside of a chamber. A substrate heating apparatus of an embodiment includes: a chamber formed with a receiving space capable of receiving a solution-coated substrate therein; a substrate heating unit arranged in the receiving space and capable of heating the substrate; and glass arranged at least between the solution coating surface of the substrate and an opposite surface of the chamber facing the coating surface. (과제) 기판의 가열 온도가 제한되기 어렵게 함과 함께, 챔버 내부에 대한 승화물의 부착을 억제한다. (해결 수단) 실시형태의 기판 가열 장치는, 용액을 도포한 기판을 수용 가능한 수용 공간이 내부에 형성된 챔버와, 상기 수용 공간에 배치됨과 함께, 상기 기판을 가열 가능한 기판 가열부와, 상기 기판에 있어서의 상기 용액의 도포면과, 상기 챔버에 있어서 상기 도포면과 대향하는 대향면과의 사이에 적어도 배치된 유리를 포함한다.