ULTRA HIGH RESOLUTION HIGH SPEED PARALLEL PROCESSING AUTO INSPECTION METHOD

According to the present invention, provided is an ultrahigh-resolution high-speed parallel processing auto-inspection method for a high-integration printed circuit board. The method includes the following steps of: obtaining inclination information of an inspection surface of a PCB by pre-scanning...

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1. Verfasser: LEE JUN UK
Format: Patent
Sprache:eng ; kor
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Zusammenfassung:According to the present invention, provided is an ultrahigh-resolution high-speed parallel processing auto-inspection method for a high-integration printed circuit board. The method includes the following steps of: obtaining inclination information of an inspection surface of a PCB by pre-scanning the inspection surface; setting a separation distance between the inspection surface of the PCB and a line scan camera to form an optimal focal point, and then, setting the set information as reference displacement information; enabling a displacement compensation means to pre-control the movement of a vertical movement member by referring to the pre-obtained inclination information when a stage is moved for obtaining a surface image of the inspection surface of the PCB; enabling the displacement compensation means to receive information about displacement with the inspection surface of the PCB in real time by operating a laser displacement sensor on the PCB placed on the stage at the same time as the stage is moved; determining whether a displacement difference occurs or not by comparing the real-time displacement information to pre-inputted reference displacement information; and enabling the displacement compensation means to perform line-scanning by moving the line scan camera on a guide rail to compensate for the displacement difference when it is confirmed that the displacement difference has occurred. Therefore, the present invention is capable of enabling quick and accurate defect detection from a PCB. 본 발명은 PCB 검사면을 사전스캐닝하여 검사면의 경사정보를 획득하는 단계; PCB의 검사면과 라인스캔카메라의 이격거리를 최적의 초점을 이루도록 세팅하고 이를 기준변위정보로 하여 설정하는 단계; PCB 검사면의 표면이미지의 획득을 위한 스테이지의 이동시 사전 획득한 상기 경사정보를 참조하여 수직이동부재의 이동을 변위보정수단이 미리 제어하는 단계; 스테이지의 이동과 동시에 상부에 놓인 PCB에 레이저변위센서를 구동하여 실시간으로 PCB 검사면과의 변위정보를 변위보정수단이 입력받는 단계; 상기 입력된 실시간 변위정보와 기 입력된 기준변위정보를 비교하여 변위차가 발생하는지를 판단하는 단계; 및 변위차가 있는 것으로 판단되면 변위보정수단은 수직이동부재를 해당 변위차 만큼 보상할 수 있도록 가이드레일 상에서 라인스캔카메라를 이동시켜 라인스캐닝을 실시하는 단계;를 포함하는 고집적 인쇄회로기판의 초고해상 고속 병렬처리 자동검사방법을 제공한다.