FLEXIBLE COPPER CLAD LAMINATE AND METHOD FOR MANUFACTURING THE SAME

The present invention relates to a flexible copper foil laminated film and a method for manufacturing the same, wherein the flexible copper foil laminated film includes a polyimide layer surface-treated by irradiating an ion beam and has 0.5 kgf/cm or more of heat-resistant adhesive strength which i...

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Bibliographische Detailangaben
Hauptverfasser:	LEE YONG HO, JUNG WOO DEUK, LEE BYOUNG GUK, KIM JONG HAK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	The present invention relates to a flexible copper foil laminated film and a method for manufacturing the same, wherein the flexible copper foil laminated film includes a polyimide layer surface-treated by irradiating an ion beam and has 0.5 kgf/cm or more of heat-resistant adhesive strength which is measured after leaving at 140-160 deg. C for 160-180 hours. According to the invention, the flexible copper foil laminated film maintains adhesive strength even at high temperatures as the surface is treated with an ion beam before metal layer deposition using sputtering, which is a physical vapor deposition (PVD) method on a polyimide film, prevents reduction of a yield due to peeling, and improves quality stability, thereby being suitable for semi-additives. 본 발명은 이온빔을 조사시켜 표면 처리된 폴리이미드층을 포함하고, 140~160℃온도에서 160~180시간 동안 방치한 후, 측정한 내열접착력이 0.5kgf/cm이상인 것을 특징으로 하는 연성동박적층필름 및 이의 제조방법에 관한 것이다. 본 발명에 따르면, 폴리이미드 필름(Polyimide Film)에의 물리기상증착법(PVD)인 스퍼터링(sputtering)법을 이용한 금속층 성막 전에 이온빔 표면처리를 통해, 고온에서도 높은 접착력을 유지하여, 박리로 인한 수율 감소를 방지하고, 품질 안정성을 향상시킴으로써 세미 애디티브용으로 적합한 연성동박적층필름 및 이의 제조방법이 제공된다.