SUBSTRATE PROCESSING DEVICE

The present invention relates to a substrate processing apparatus, which includes: a rotatable base unit; a support unit mounted on the base unit and aligning a substrate; a heating unit mounted on the base unit and heating the substrate; a cover unit arranged between the base unit and the substrate...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	BAE JEONGHYUN, LEE YANGHO, LEE SEUNGHOON, MO SUNGWON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	The present invention relates to a substrate processing apparatus, which includes: a rotatable base unit; a support unit mounted on the base unit and aligning a substrate; a heating unit mounted on the base unit and heating the substrate; a cover unit arranged between the base unit and the substrate to cover the heating unit; and a heat radiation restricting unit supporting the bottom of the substrate and suppressing radiation of heat passing through the cover unit, thereby uniformly maintaining temperature of the substrate and improving an etching rate. 본 발명은 기판처리장치에 관한 것으로, 회전 가능한 베이스부와, 베이스부에 장착되고 기판을 정렬하는 지지부와, 베이스부에 장착되고 기판을 가열하는 히팅부와, 베이스부와 기판 사이에 배치되어 히팅부를 덮는 커버부와, 기판의 저면을 지지하고 커버부를 통과한 열의 방출을 억제하는 방열제한부를 포함하여, 기판의 온도를 균일하게 유지하고 에칭률을 향상시킬 수 있다.