Material for circuit board and method for preparing the printed circuit board
The present invention provides a material for circuit board and, more specifically, to a material for circuit board to solve the blur and provide the high reliability to be suitable for implementing a circuit for high frequency and high speed as a material for circuit board formed by a semi-additive...
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| creator | PARK MYONG WHAN CHUN SUNG WOOK LEE DAE HOON CHUNG BOMOOK KANG YOUN BONG |
| description | The present invention provides a material for circuit board and, more specifically, to a material for circuit board to solve the blur and provide the high reliability to be suitable for implementing a circuit for high frequency and high speed as a material for circuit board formed by a semi-additive method, and a manufacturing method of a printed circuit board. The manufacturing method comprises the processes of: (i) preparing a copper foil with a carrier including a transfer layer; (ii) manufacturing a structure on which the copper foil with the carrier is laminated; and (iii) forming a laminated plate provided with the transfer layer through a process of peeling the carrier from the manufactured laminated structure.
본 발명은 회로기판용 자재, 특히 세미 애디티브법에 의해 형성된 회로기판용 자재로서 번짐 문제를 해소하고 고주파, 고속전송용 회로 구현에 적합하는 등 높은 신뢰성을 제공하는 회로기판용 자재 및 인쇄회로기판 제조방법을 제공한다. |
| format | Patent |
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본 발명은 회로기판용 자재, 특히 세미 애디티브법에 의해 형성된 회로기판용 자재로서 번짐 문제를 해소하고 고주파, 고속전송용 회로 구현에 적합하는 등 높은 신뢰성을 제공하는 회로기판용 자재 및 인쇄회로기판 제조방법을 제공한다.</description><language>eng ; kor</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191231&DB=EPODOC&CC=KR&NR=20190143619A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191231&DB=EPODOC&CC=KR&NR=20190143619A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PARK MYONG WHAN</creatorcontrib><creatorcontrib>CHUN SUNG WOOK</creatorcontrib><creatorcontrib>LEE DAE HOON</creatorcontrib><creatorcontrib>CHUNG BOMOOK</creatorcontrib><creatorcontrib>KANG YOUN BONG</creatorcontrib><title>Material for circuit board and method for preparing the printed circuit board</title><description>The present invention provides a material for circuit board and, more specifically, to a material for circuit board to solve the blur and provide the high reliability to be suitable for implementing a circuit for high frequency and high speed as a material for circuit board formed by a semi-additive method, and a manufacturing method of a printed circuit board. The manufacturing method comprises the processes of: (i) preparing a copper foil with a carrier including a transfer layer; (ii) manufacturing a structure on which the copper foil with the carrier is laminated; and (iii) forming a laminated plate provided with the transfer layer through a process of peeling the carrier from the manufactured laminated structure.
본 발명은 회로기판용 자재, 특히 세미 애디티브법에 의해 형성된 회로기판용 자재로서 번짐 문제를 해소하고 고주파, 고속전송용 회로 구현에 적합하는 등 높은 신뢰성을 제공하는 회로기판용 자재 및 인쇄회로기판 제조방법을 제공한다.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPD1TSxJLcpMzFFIyy9SSM4sSi7NLFFIyk8sSlFIzEtRyE0tychPAUsWFKUWJBZl5qUrlGSkAnmZeSWpKahaeBhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJvHeQkYGhpYGhibGZoaWjMXGqAJJoNt4</recordid><startdate>20191231</startdate><enddate>20191231</enddate><creator>PARK MYONG WHAN</creator><creator>CHUN SUNG WOOK</creator><creator>LEE DAE HOON</creator><creator>CHUNG BOMOOK</creator><creator>KANG YOUN BONG</creator><scope>EVB</scope></search><sort><creationdate>20191231</creationdate><title>Material for circuit board and method for preparing the printed circuit board</title><author>PARK MYONG WHAN ; CHUN SUNG WOOK ; LEE DAE HOON ; CHUNG BOMOOK ; KANG YOUN BONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20190143619A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2019</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>PARK MYONG WHAN</creatorcontrib><creatorcontrib>CHUN SUNG WOOK</creatorcontrib><creatorcontrib>LEE DAE HOON</creatorcontrib><creatorcontrib>CHUNG BOMOOK</creatorcontrib><creatorcontrib>KANG YOUN BONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PARK MYONG WHAN</au><au>CHUN SUNG WOOK</au><au>LEE DAE HOON</au><au>CHUNG BOMOOK</au><au>KANG YOUN BONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Material for circuit board and method for preparing the printed circuit board</title><date>2019-12-31</date><risdate>2019</risdate><abstract>The present invention provides a material for circuit board and, more specifically, to a material for circuit board to solve the blur and provide the high reliability to be suitable for implementing a circuit for high frequency and high speed as a material for circuit board formed by a semi-additive method, and a manufacturing method of a printed circuit board. The manufacturing method comprises the processes of: (i) preparing a copper foil with a carrier including a transfer layer; (ii) manufacturing a structure on which the copper foil with the carrier is laminated; and (iii) forming a laminated plate provided with the transfer layer through a process of peeling the carrier from the manufactured laminated structure.
본 발명은 회로기판용 자재, 특히 세미 애디티브법에 의해 형성된 회로기판용 자재로서 번짐 문제를 해소하고 고주파, 고속전송용 회로 구현에 적합하는 등 높은 신뢰성을 제공하는 회로기판용 자재 및 인쇄회로기판 제조방법을 제공한다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Material for circuit board and method for preparing the printed circuit board |
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