Material for circuit board and method for preparing the printed circuit board

The present invention provides a material for circuit board and, more specifically, to a material for circuit board to solve the blur and provide the high reliability to be suitable for implementing a circuit for high frequency and high speed as a material for circuit board formed by a semi-additive method, and a manufacturing method of a printed circuit board. The manufacturing method comprises the processes of: (i) preparing a copper foil with a carrier including a transfer layer; (ii) manufacturing a structure on which the copper foil with the carrier is laminated; and (iii) forming a laminated plate provided with the transfer layer through a process of peeling the carrier from the manufactured laminated structure. 본 발명은 회로기판용 자재, 특히 세미 애디티브법에 의해 형성된 회로기판용 자재로서 번짐 문제를 해소하고 고주파, 고속전송용 회로 구현에 적합하는 등 높은 신뢰성을 제공하는 회로기판용 자재 및 인쇄회로기판 제조방법을 제공한다.