APPARATUS AND METHOD FOR DRYING WAFER

Disclosed is a semiconductor light emitting device in contact with an ejection needle, comprising: a plurality of light emitting portions formed on a substrate, wherein the light emitting portions are composed of a first light emitting portion and a second light emitting portion, each including a fi...

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1. Verfasser: JIN GEUN MO
Format: Patent
Sprache:eng ; kor
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