Apparatus for processing substrate
Provided is a substrate processing apparatus, which has an improved cleaning effect. The substrate processing apparatus includes: a support member which is installed in the chamber and on which a substrate is mounted; a liquid chemical spraying part installed in the chamber and spraying liquid chemi...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; kor |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | JANG YOUNG JIN KIM JONG HAN JUNG BU YOUNG YU JIN TACK SONG GIL HUN |
| description | Provided is a substrate processing apparatus, which has an improved cleaning effect. The substrate processing apparatus includes: a support member which is installed in the chamber and on which a substrate is mounted; a liquid chemical spraying part installed in the chamber and spraying liquid chemical vapor to the substrate; a liquid chemical discharge part installed in the chamber and discharging liquid chemical to the substrate; and a cooling part installed on the support member and cooling the substrate, wherein the liquid chemical spraying part sprays the liquid chemical vapor to the substrate while the cooling part cools the substrate during a first section and the liquid chemical discharge part discharges the liquid chemical to the substrate during a second section partially overlapped with the first section.
세정 효과가 향상된 기판 처리 장치가 제공된다. 상기 기판 처리 장치는 챔버 내에 설치되고, 기판이 안착되는 지지 부재; 상기 챔버 내에 설치되고, 상기 기판에 약액 증기를 분사하는 약액 분사부; 상기 챔버 내에 설치되고, 상기 기판에 약액을 토출하는 약액 토출부; 및 상기 지지 부재에 설치되어, 상기 기판을 냉각하는 냉각부를 포함하되, 제1 구간 동안 상기 냉각부가 상기 기판을 냉각시키면서 상기 약액 분사부는 상기 기판에 약액 증기를 분사하고, 상기 제1 구간과 일부 오버랩되는 제2 구간 동안 상기 약액 토출부가 상기 기판에 상기 약액을 토출하는 것을 포함한다. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20190140243A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20190140243A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20190140243A3</originalsourceid><addsrcrecordid>eNrjZFByLChILEosKS1WSMsvUigoyk9OLS7OzEtXKC5NKi4ByqTyMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JJ47yAjA0NLA0MTAyMTY0dj4lQBAHZTJ0s</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Apparatus for processing substrate</title><source>esp@cenet</source><creator>JANG YOUNG JIN ; KIM JONG HAN ; JUNG BU YOUNG ; YU JIN TACK ; SONG GIL HUN</creator><creatorcontrib>JANG YOUNG JIN ; KIM JONG HAN ; JUNG BU YOUNG ; YU JIN TACK ; SONG GIL HUN</creatorcontrib><description>Provided is a substrate processing apparatus, which has an improved cleaning effect. The substrate processing apparatus includes: a support member which is installed in the chamber and on which a substrate is mounted; a liquid chemical spraying part installed in the chamber and spraying liquid chemical vapor to the substrate; a liquid chemical discharge part installed in the chamber and discharging liquid chemical to the substrate; and a cooling part installed on the support member and cooling the substrate, wherein the liquid chemical spraying part sprays the liquid chemical vapor to the substrate while the cooling part cools the substrate during a first section and the liquid chemical discharge part discharges the liquid chemical to the substrate during a second section partially overlapped with the first section.
세정 효과가 향상된 기판 처리 장치가 제공된다. 상기 기판 처리 장치는 챔버 내에 설치되고, 기판이 안착되는 지지 부재; 상기 챔버 내에 설치되고, 상기 기판에 약액 증기를 분사하는 약액 분사부; 상기 챔버 내에 설치되고, 상기 기판에 약액을 토출하는 약액 토출부; 및 상기 지지 부재에 설치되어, 상기 기판을 냉각하는 냉각부를 포함하되, 제1 구간 동안 상기 냉각부가 상기 기판을 냉각시키면서 상기 약액 분사부는 상기 기판에 약액 증기를 분사하고, 상기 제1 구간과 일부 오버랩되는 제2 구간 동안 상기 약액 토출부가 상기 기판에 상기 약액을 토출하는 것을 포함한다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191219&DB=EPODOC&CC=KR&NR=20190140243A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191219&DB=EPODOC&CC=KR&NR=20190140243A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JANG YOUNG JIN</creatorcontrib><creatorcontrib>KIM JONG HAN</creatorcontrib><creatorcontrib>JUNG BU YOUNG</creatorcontrib><creatorcontrib>YU JIN TACK</creatorcontrib><creatorcontrib>SONG GIL HUN</creatorcontrib><title>Apparatus for processing substrate</title><description>Provided is a substrate processing apparatus, which has an improved cleaning effect. The substrate processing apparatus includes: a support member which is installed in the chamber and on which a substrate is mounted; a liquid chemical spraying part installed in the chamber and spraying liquid chemical vapor to the substrate; a liquid chemical discharge part installed in the chamber and discharging liquid chemical to the substrate; and a cooling part installed on the support member and cooling the substrate, wherein the liquid chemical spraying part sprays the liquid chemical vapor to the substrate while the cooling part cools the substrate during a first section and the liquid chemical discharge part discharges the liquid chemical to the substrate during a second section partially overlapped with the first section.
세정 효과가 향상된 기판 처리 장치가 제공된다. 상기 기판 처리 장치는 챔버 내에 설치되고, 기판이 안착되는 지지 부재; 상기 챔버 내에 설치되고, 상기 기판에 약액 증기를 분사하는 약액 분사부; 상기 챔버 내에 설치되고, 상기 기판에 약액을 토출하는 약액 토출부; 및 상기 지지 부재에 설치되어, 상기 기판을 냉각하는 냉각부를 포함하되, 제1 구간 동안 상기 냉각부가 상기 기판을 냉각시키면서 상기 약액 분사부는 상기 기판에 약액 증기를 분사하고, 상기 제1 구간과 일부 오버랩되는 제2 구간 동안 상기 약액 토출부가 상기 기판에 상기 약액을 토출하는 것을 포함한다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFByLChILEosKS1WSMsvUigoyk9OLS7OzEtXKC5NKi4ByqTyMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JJ47yAjA0NLA0MTAyMTY0dj4lQBAHZTJ0s</recordid><startdate>20191219</startdate><enddate>20191219</enddate><creator>JANG YOUNG JIN</creator><creator>KIM JONG HAN</creator><creator>JUNG BU YOUNG</creator><creator>YU JIN TACK</creator><creator>SONG GIL HUN</creator><scope>EVB</scope></search><sort><creationdate>20191219</creationdate><title>Apparatus for processing substrate</title><author>JANG YOUNG JIN ; KIM JONG HAN ; JUNG BU YOUNG ; YU JIN TACK ; SONG GIL HUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20190140243A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>JANG YOUNG JIN</creatorcontrib><creatorcontrib>KIM JONG HAN</creatorcontrib><creatorcontrib>JUNG BU YOUNG</creatorcontrib><creatorcontrib>YU JIN TACK</creatorcontrib><creatorcontrib>SONG GIL HUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JANG YOUNG JIN</au><au>KIM JONG HAN</au><au>JUNG BU YOUNG</au><au>YU JIN TACK</au><au>SONG GIL HUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Apparatus for processing substrate</title><date>2019-12-19</date><risdate>2019</risdate><abstract>Provided is a substrate processing apparatus, which has an improved cleaning effect. The substrate processing apparatus includes: a support member which is installed in the chamber and on which a substrate is mounted; a liquid chemical spraying part installed in the chamber and spraying liquid chemical vapor to the substrate; a liquid chemical discharge part installed in the chamber and discharging liquid chemical to the substrate; and a cooling part installed on the support member and cooling the substrate, wherein the liquid chemical spraying part sprays the liquid chemical vapor to the substrate while the cooling part cools the substrate during a first section and the liquid chemical discharge part discharges the liquid chemical to the substrate during a second section partially overlapped with the first section.
세정 효과가 향상된 기판 처리 장치가 제공된다. 상기 기판 처리 장치는 챔버 내에 설치되고, 기판이 안착되는 지지 부재; 상기 챔버 내에 설치되고, 상기 기판에 약액 증기를 분사하는 약액 분사부; 상기 챔버 내에 설치되고, 상기 기판에 약액을 토출하는 약액 토출부; 및 상기 지지 부재에 설치되어, 상기 기판을 냉각하는 냉각부를 포함하되, 제1 구간 동안 상기 냉각부가 상기 기판을 냉각시키면서 상기 약액 분사부는 상기 기판에 약액 증기를 분사하고, 상기 제1 구간과 일부 오버랩되는 제2 구간 동안 상기 약액 토출부가 상기 기판에 상기 약액을 토출하는 것을 포함한다.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; kor |
| recordid | cdi_epo_espacenet_KR20190140243A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Apparatus for processing substrate |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T00%3A16%3A05IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JANG%20YOUNG%20JIN&rft.date=2019-12-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20190140243A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |