LED LED BONDING APPARATUS FOR MICRO LED DEVICE AND BONDING METHOD FOR MICRO LED DEVICE

LED LED BONDING APPARATUS FOR MICRO LED DEVICE AND BONDING METHOD FOR MICRO LED DEVICE

The present invention relates to a bonding apparatus for a micro LED device, which bonds a micro LED device mounted on a substrate to a PCB, and a bonding method of a micro LED device, and specifically, to a bonding apparatus for a micro LED device and a bonding method of a micro LED device, which a...

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Hauptverfasser: LEE CHANG BOK, MOON BYUNG KWAN
Format: Patent
Sprache:eng ; kor
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LEE CHANG BOK
MOON BYUNG KWAN
description The present invention relates to a bonding apparatus for a micro LED device, which bonds a micro LED device mounted on a substrate to a PCB, and a bonding method of a micro LED device, and specifically, to a bonding apparatus for a micro LED device and a bonding method of a micro LED device, which are possible to perform a detailed bonding process by preventing alignment position errors generated when picking up a micro LED device. 본 발명은 기판에 안착된 마이크로 LED 소자를 PCB에 본딩시키는 마이크로 LED 소자용 본딩장치 및 마이크로 LED 소자용 본딩 방법에 관한 것으로서, 특히, 마이크로 LED 소자의 픽업시 발생되는 정렬 위치 오차를 방지하여, 정밀한 본딩 공정을 수행할 수 있는 마이크로 LED 소자용 본딩장치 및 마이크로 LED 소자용 본딩 방법에 관한 것이다.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LED LED BONDING APPARATUS FOR MICRO LED DEVICE AND BONDING METHOD FOR MICRO LED DEVICE
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