LED LED BONDING APPARATUS FOR MICRO LED DEVICE AND BONDING METHOD FOR MICRO LED DEVICE

The present invention relates to a bonding apparatus for a micro LED device, which bonds a micro LED device mounted on a substrate to a PCB, and a bonding method of a micro LED device, and specifically, to a bonding apparatus for a micro LED device and a bonding method of a micro LED device, which a...

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Bibliographische Detailangaben
Hauptverfasser:	LEE CHANG BOK, MOON BYUNG KWAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention relates to a bonding apparatus for a micro LED device, which bonds a micro LED device mounted on a substrate to a PCB, and a bonding method of a micro LED device, and specifically, to a bonding apparatus for a micro LED device and a bonding method of a micro LED device, which are possible to perform a detailed bonding process by preventing alignment position errors generated when picking up a micro LED device. 본 발명은 기판에 안착된 마이크로 LED 소자를 PCB에 본딩시키는 마이크로 LED 소자용 본딩장치 및 마이크로 LED 소자용 본딩 방법에 관한 것으로서, 특히, 마이크로 LED 소자의 픽업시 발생되는 정렬 위치 오차를 방지하여, 정밀한 본딩 공정을 수행할 수 있는 마이크로 LED 소자용 본딩장치 및 마이크로 LED 소자용 본딩 방법에 관한 것이다.