Metal paste for manufacturing thermoelectric module and thermoelectric module manufactured using the same

An embodiment of the present invention relates to metal paste for manufacturing a thermoelectric module and, more specifically, to metal paste for manufacturing a thermoelectric module, which constitutes a bonding layer, as sintered, to bond an electrode of a thermoelectric module to a thermoelectri...

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Bibliographische Detailangaben
Hauptverfasser: KIM DONG SIK, PARK CHEOL HEE, LEE DAE KI, KIM DAE HUN, IM YE HOON, CHOI JUN WON, SONG YOUNG SOO
Format: Patent
Sprache:eng ; kor
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Zusammenfassung:An embodiment of the present invention relates to metal paste for manufacturing a thermoelectric module and, more specifically, to metal paste for manufacturing a thermoelectric module, which constitutes a bonding layer, as sintered, to bond an electrode of a thermoelectric module to a thermoelectric element. The metal paste of the present invention comprises: a first metal particle (particle A) constituting powder of first metal; and a second metal particle (particle B) constituting powder of second metal, wherein an index of a mass ratio of particle A to particle B is in a range of 0.5 to 1 and the index of a mass ratio is defined as follows: Index of mass ratio = #_(B/A) / [#B_(total)/#A_(total)], wherein #_(B/A) is an average number of particles B coming in contact with one particle A in the paste (provided that, when n particles A come in contact with one particle B, the number of particles B in contact with one particle A is calculated as 1/n), #B_(total) is a total number of particles B present in the paste, and #A_(total) is a total number of particles A present in the paste. The present invention can provide a thermoelectric module with improved quality. 본 발명의 일 실시예에 따른 열전 모듈 제조용 금속 페이스트는, 소결됨으로써 열전 모듈의 전극과 열전 소자 간을 접합시키는 접합층을 이루는 열전 모듈 제조용 금속 페이스트로서, 제1 금속의 분말을 구성하는 제1 금속 입자(A 입자) 및 상기 제1 금속과는 다른 종류인 제2 금속의 분말을 구성하는 제2 금속 입자(B 입자)를 포함하며, 상기 A 입자와 B 입자의 질량비 지표가 0.5 내지 1 범위이며, 상기 질량비 지표는 아래와 같이 정의된다: * 질량비 지표 = #/ (#B/ #A) * #: 페이스트 내에서 A 입자 1개 당 접촉한 B 입자의 평균 개수(단, B 입자에 A 입자가 n개 접촉한 경우 A 입자 1개에 접촉한 B 입자의 수는 1/n 으로 산정) * #B: 페이스트 내에 존재하는 B 입자의 총 개수 * #A: 페이스트 내에 존재하는 A 입자의 총 개수