APPARATUS FOR CUTTING SUBSTRATE

According to an embodiment of the present invention, a substrate cutting apparatus includes: a scribing unit forming a scribing line on a substrate; a transfer unit on which the substrate is mounted and which has a support belt moving in a transfer direction of the substrate so as to transfer the su...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	PARK JI WOONG, PARK SANG DEUK, JUNG HA JIN, PARK SOO HOON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	According to an embodiment of the present invention, a substrate cutting apparatus includes: a scribing unit forming a scribing line on a substrate; a transfer unit on which the substrate is mounted and which has a support belt moving in a transfer direction of the substrate so as to transfer the substrate to the scribing unit; and a belt maintaining unit grasping both ends of the support belt in a direction crossing over the transfer direction of the substrate and moving in the transfer direction of the substrate along with the support belt. 본 발명의 실시예에 따른 기판 절단 장치는, 기판에 스크라이빙 라인을 형성하는 스크라이빙 유닛; 기판이 안착되며, 기판을 스크라이빙 유닛으로 이송하도록 기판의 이송 방향으로 이동하는 지지 벨트를 포함하는 이송 유닛; 및 기판의 이송 방향에 직교하는 방향으로의 지지 벨트의 양단을 파지하여 지지 벨트와 함께 기판의 이송 방향으로 이동하는 벨트 유지 유닛을 포함할 수 있다.