Shot Blasting Device Controlling Projection Angle

Disclosed is a short blasting apparatus capable of adjusting a projection angle of an abrasive. The present invention comprises: an impeller ejecting the abrasive into a product to be polished; an impeller housing in which the impeller is installed; and a rotary housing in which the impeller housing...

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1. Verfasser: JEONG TAE YEONG
Format: Patent
Sprache:eng ; kor
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Zusammenfassung:Disclosed is a short blasting apparatus capable of adjusting a projection angle of an abrasive. The present invention comprises: an impeller ejecting the abrasive into a product to be polished; an impeller housing in which the impeller is installed; and a rotary housing in which the impeller housing fixedly installed, and rotationally installed in the short blasting apparatus. According to the present invention, as the projection angle of the abrasive can be adjusted laterally according to the structure and shape of the product to be polished, more precise polishing is possible. 연마제의 투사 각도 조절이 가능한 쇼트 블라스팅 장치가 개시된다. 본 발명은, 연마 대상 제품에 연마제를 분출하는 임펠러, 임펠러가 내부에 설치되는 임펠러 하우징, 및 임펠러 하우징이 고정 설치되며, 쇼트 블라스팅 장치에 회동 가능하게 설치되는 회동식 하우징을 구비한다. 본 발명에 따르면, 연마 대상 제품의 구조 및 형상에 따라 임펠러의 연마제 투사 각도를 측방향으로 조절할 수 있게 됨에 따라 보다 정교한 연마 작업이 가능하게 된다.