LEAD-FREE SOLDER COMPOSITION AND METHOD FOR MAUNFACTURING THEREOF

The present invention relates to a lead-free solder alloy composition and a manufacturing method thereof. Provided is the lead-free solder alloy composition comprising: a solder including at least one alloy selected from a Sn-Ag-Cu alloy, a Sn-Cu alloy, and a Sn-Ag alloy; and an additive including t...

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Bibliographische Detailangaben
Hauptverfasser:	JUNG DO HYUN, RAJENDRAN SRI HARINI, JUNG JAE PIL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ALLOYS APPARATUS THEREFOR CASTING CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS POWDER METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	The present invention relates to a lead-free solder alloy composition and a manufacturing method thereof. Provided is the lead-free solder alloy composition comprising: a solder including at least one alloy selected from a Sn-Ag-Cu alloy, a Sn-Cu alloy, and a Sn-Ag alloy; and an additive including tungsten (W) metal nanopowder. Therefore, the present invention is capable of minimizing an environmental impact of hazardous metal materials such as lead and the like. 무연 솔더 합금 조성물 및 이의 제조방법에 관한 것으로, Sn-Ag-Cu 합금, Sn-Cu 합금 및 Sn-Ag 합금 중에서 선택되는 하나 이상의 합금을 포함하는 솔더; 및 텅스텐(W) 금속 나노 분말을 포함하는 첨가제;를 포함하는 무연솔더 합금 조성물을 제공할 수 있다.