PLATING APPARATUS AND METHOD THEREOF

The present invention relates to a plating apparatus and method. According to an embodiment of the present invention, provided is a plating apparatus which places an electrode inside a specimen, supplies power to the specimen and the electrode, and circulates a plating solution into the specimen to...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	CHO HWANG RAE, HAN YEOUNG MIN, KIM YOUNG JUNE, JUNG NAM CHEOL, BANG JEONG SEOK, KIM JIN HYUNG, LEE KYU HWAN, BAE BHYUN HYUN, RHEE BYONG HO, HYUN SEONG YOON, NOH YONG OH, SO YOUN SEOK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to a plating apparatus and method. According to an embodiment of the present invention, provided is a plating apparatus which places an electrode inside a specimen, supplies power to the specimen and the electrode, and circulates a plating solution into the specimen to plate the inside of the specimen. 본 발명은 도금 장치 및 방법에 관한 것이다. 본 발명의 일 실시예에 따르면, 시편의 내부에 전극을 배치하고, 상기 시편과 상기 전극에 전원을 공급하며, 상기 시편의 내부로 도금 용액을 순환시켜 상기 시편의 내부를 도금하는, 도금 장치를 제공한다.