Apparatus for Bonding Semiconductor Chip and Method for Bonding Semiconductor Chip

The present invention relates to a semiconductor chip bonding apparatus and a semiconductor chip bonding method. More particularly, the present invention relates to the semiconductor chip bonding apparatus and the semiconductor chip bonding method for bonding a semiconductor chip to the top surface...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	AHN GEUNSIK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to a semiconductor chip bonding apparatus and a semiconductor chip bonding method. More particularly, the present invention relates to the semiconductor chip bonding apparatus and the semiconductor chip bonding method for bonding a semiconductor chip to the top surface of a substrate or another semiconductor chip. According to the present invention, the semiconductor chip bonding apparatus and the semiconductor chip bonding method have the effect of rapidly and accurately bonding a semiconductor chip to a substrate or another semiconductor chip and increasing productivity. The semiconductor chip bonding apparatus includes a fixing member, a pressing member, an elevating member, and a laser head. 본 발명은 반도체 칩 본딩 장치 및 반도체 칩 본딩 방법에 관한 것으로서, 더욱 상세하게는 반도체 칩을 기판 또는 다른 반도체 칩의 상면에 본딩하는 반도체 칩 본딩 장치 및 반도체 칩 본딩 방법에 관한 것이다. 본 발명에 의한 반도체 칩 본딩 장치 및 반도체 칩 본딩 방법은 반도체 칩을 기판 또는 다른 반도체 칩에 빠르고 정확하게 본딩하여 생산성을 향상시키는 효과가 있다.