substrate cleaning method substrate cleaning apparatus and manufacturing method of semiconductor device using the same

According to the present invention, disclosed are a substrate cleaning method, a substrate cleaning device, and a method of manufacturing a semiconductor device using the same. The method includes: a step of performing wet cleaning on a substrate; a step of providing a supercritical fluid on the sub...

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Bibliographische Detailangaben
Hauptverfasser:	CHOI HOSEOP, HAN KYUHEE, YOO BEOMJIN, BANG JEONGMIN, JANG WONHYUK, KIM MINHYOUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	According to the present invention, disclosed are a substrate cleaning method, a substrate cleaning device, and a method of manufacturing a semiconductor device using the same. The method includes: a step of performing wet cleaning on a substrate; a step of providing a supercritical fluid on the substrate to dry the substrate; and a step of performing dry cleaning on the substrate to remove defective particles generated on the substrate by the supercritical fluid. It is possible to remove the defective particles. 본 발명은 기판 세정 방법, 기판 세정 장치 및 그를 이용한 반도체 소자의 제조방법을 개시한다. 그의 방법은, 기판을 습식으로 세정하는 단계와, 상기 기판 상에 초임계 유체를 제공하여 상기 기판을 건식으로 건조하는 단계와, 상기 기판을 건식으로 세정하여 상기 초임계 유체에 의해 상기 기판 상에 생성되는 결함 입자를 제거하는 단계를 포함한다.