SEMICONDUCTOR DEVICE PACKAGE

According to an embodiment of the present invention, disclosed is a semiconductor device package which comprises: a body including a cavity; a semiconductor device arranged in the cavity; a light transmitting member arranged in the cavity; and a bonding layer fixing the light transmitting member to...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE SEUNG JAE, SONG SUNG JOO, LEE YEONG JUNE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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