SEMICONDUCTOR DEVICE PACKAGE
According to an embodiment of the present invention, disclosed is a semiconductor device package which comprises: a body including a cavity; a semiconductor device arranged in the cavity; a light transmitting member arranged in the cavity; and a bonding layer fixing the light transmitting member to...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | According to an embodiment of the present invention, disclosed is a semiconductor device package which comprises: a body including a cavity; a semiconductor device arranged in the cavity; a light transmitting member arranged in the cavity; and a bonding layer fixing the light transmitting member to the body. The semiconductor device generates light of an ultraviolet wavelength range. The bonding layer includes a polymer resin and a wave conversion particle generating light of a visible wavelength range by absorbing light of the ultraviolet wavelength range.
실시 예는, 캐비티를 포함하는 몸체; 상기 캐비티에 배치되는 반도체 소자; 상기 캐비티 상에 배치되는 투광부재; 및 상기 투광부재를 상기 몸체에 고정하는 접착층을 포함하고, 상기 반도체 소자는 자외선 파장대의 광을 생성하고, 상기 접착층은 고분자 수지, 및 상기 자외선 파장대의 광을 흡수하여 가시광 파장대의 광을 생성하는 파장 변환 입자를 포함하는 반도체 소자 패키지를 개시한다. |
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