A VACCUM CHUCK FOR WAFER

The present invention relates to a vacuum chuck for a wafer. More specifically, the vacuum chuck for a wafer includes: a base table located on a dicing facility including a control part and a dicing unit, and including a vacuum flow path connected to a vacuum source; a porous part on which a wafer i...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YOOK IN SOO, YOO SUNG WOONG, LEE DONG HEON, KIM CHANG SOO
Format: Patent
Sprache:eng ; kor
Schlagworte:
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