LEAD FREE SOLDER COMPOSITION AND MANUFACTURING METHOD OF THE SAME MANUFACTURING METHOD OF PIEZOELECTRIC ELEMENT USING LEAD FREE SOLDER COMPOSITION

Provided is a lead free solder composition which comprises: solder containing at least one type of a Sn-Bi alloy, a Sn-In alloy, a Sn-Bi-Ag alloy, an In-Ag alloy and a Sn-Bi-In alloy; and a carbon structure added to the solder. Sn-Bi 합금, Sn-In 합금, Sn-Bi-Ag 합금, In-Ag 합금 및 Sn-Bi-In 합금 중에서 1종 이상을 포함하는...

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Bibliographische Detailangaben
Hauptverfasser:	JUNG, DO HYUN, RAJENDRAN SRI HARINI, JUNG, JAE PIL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided is a lead free solder composition which comprises: solder containing at least one type of a Sn-Bi alloy, a Sn-In alloy, a Sn-Bi-Ag alloy, an In-Ag alloy and a Sn-Bi-In alloy; and a carbon structure added to the solder. Sn-Bi 합금, Sn-In 합금, Sn-Bi-Ag 합금, In-Ag 합금 및 Sn-Bi-In 합금 중에서 1종 이상을 포함하는 솔더; 및 상기 솔더에 첨가되는 탄소 구조체;를 포함하는 무연솔더 합금 조성물이 소개된다.